special dp to hdmi 2.0 for communication products

dp to hdmi 2.0 description

The operation process of this product is stable and reliable owing to the reasonably designed and arranged components and parts. This product allows users to share an Internet connection among multiple devices

special dp to hdmi 2.0 for communication products-1

special dp to hdmi 2.0 for communication products-2

dp to hdmi 2.0 SPECIFICATIONS

Model No：	HD901
Versions:	1.4v
Appearance:	Injection Plastic+ABS
Connector Type：	HDMI 20 P A/M to A/M
Connector:	Nickel -plated
Conductor：	High purity Oxygen Free Copper (CU)
Gauge:	AWG: 24/26/28/30(optional)
Insulation:	HD-PE
Shielding:	AL+ ML+ Braiding (Triple shielding )
Outer Diamete:	6.0mm,7.3mm,8.0mm,9.0mm (optional)
Jacket:	PVC
Color:	Black (optional)
Length:	3FT to 50FT (1m-15m) optional

This product has the ability to ensure signal integrity. It has been accepted by the consumer/ institutional electronics industry. This product is able to deliver a high-quality and stable digital signal.

Suggested Videos

n******a

Each step of HDeramini displayport to displayport production is carefully and rigorously monitored. The pure copper conductors ensure the speed of the data

v******t

HDera mini displayport to displayport is built with unique style and compatible structure. Its length can be customized according to needs

e******o

HDera mini displayport to displayport is made by raw materials which meet the quality standards. This product is able to deliver a high-quality and stable digital signal

z******t

The production technique of HDera dp to hdmi 2.0 is advanced and guaranteed. With the help of a special adapter, the product can be converted into other types of cable

v******a

The technical production standard of HDera dp to hdmi 2.0 far exceeds the market average. This product is in compliance with the standards of the European Union Association and the HDMI Association of the United States

k******y

The product has excellent mechanical strength and loading capacity. It is treated with die-casting under high-temperature and high-pressure conditions, therefore its structure is firm and tough. Its third shielding layer ensures maximum avoiding of EMI and RFI